MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. • Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques • Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs • Discusses properties, preparation, and growth of silicon crystals and wafers • Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
The increasing demand for mobile and wireless sensing necessitates the use of highly integrated technology featuring small size, low weight, high performance and low cost: micro-electro-mechanical systems (MEMS) can meet this need. The Handbook of MEMS for wireless and mobile applications provides a comprehensive overview of radio frequency (RF) MEMS technologies and explores the use of these technologies over a wide range of application areas. Part one provides an introduction to the use of RF MEMS as an enabling technology for wireless applications. Chapters review RF MEMS technology and applications as a whole before moving on to describe specific technologies for wireless applications including passive components, phase shifters and antennas. Packaging and reliability of RF MEMS is also discussed. Chapters in part two focus on wireless techniques and applications of wireless MEMS including biomedical applications, such as implantable MEMS, intraocular pressure sensors and wireless drug delivery. Further chapters highlight the use of RF MEMS for automotive radar, the monitoring of telecommunications reliability using wireless MEMS and the use of optical MEMS displays in portable electronics. With its distinguished editor and international team of expert authors, the Handbook of MEMS for wireless and mobile applications is a technical resource for MEMS manufacturers, the electronics industry, and scientists, engineers and academics working on MEMS and wireless systems. Reviews the use of radio frequency (RF) MEMS as an enabling technology for wireless applications Discusses wireless techniques and applications of wireless MEMS, including biomedical applications Describes monitoring structures and the environment with wireless MEMS
This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.
For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. This book provides a comprehensive insight into the tools necessary for fabricating MEMS/NEMS and the process technologies applied. Besides, it describes enabling technologies which are necessary for a successful production, i.e., wafer planarization and bonding, as well as contamination control.
The field of materials science and engineering is rapidly evolving into a science of its own. While traditional literature in this area often concentrates primarily on property and structure, the Materials Processing Handbook provides a much needed examination from the materials processing perspective. This unique focus reflects the changing comple
This edition published by results of International Conference on Industrial Engineering (ICIE-2016, May 19-20, 2016, Chelyabinsk, Russian Federation). In the issue are collected scientific papers from area of materials engineering and technologies for materials production and processing in the different areas of modern manufacturing. This collection will be useful for wide range of engineers and scientists from different areas of engineering knowledges.
This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Part of a compilation of diverse information into a single, two-volume resource just at the moment when researchers are weighing the alternatives to visible light that will be necessary to etch features smaller than 0.13 microns. Volume Two focuses on the process technology and the device applicatio
A one-stop desk reference, for engineers involved in the use of engineered materials across engineering and electronics, this book will not gather dust on the shelf. It brings together the essential professional reference content from leading international contributors in the field. Material ranges from basic to advanced topics, including materials and process selection and explanations of properties of metals, ceramics, plastics and composites. A hard-working desk reference, providing all the essential material needed by engineers on a day-to-day basis Fundamentals, key techniques, engineering best practice and rules-of-thumb together in one quick-reference sourcebook Definitive content by the leading authors in the field, including Michael Ashby, Robert Messler, Rajiv Asthana and R.J. Crawford
This thoroughly updated new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. It forms a bridge between fundamental theory and practical application, giving an insight into innovative new materials, devices and systems. Organized into three parts for ease of use, this Handbook introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS. Wide varieties of functional thin film materials and processing are described, and experimental data is provided with detailed examples and theoretical descriptions. A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere
The new edition of this professional resource reveals how to optimize all aspects of the global manufacturing process to build the highest quality goods at the lowest price in the shortest possible time. How can one apply technical and business knowledge to develop a strategic plan that delivers increased productivity, quality, sustainability, reliability, agility, resilience, and best practices with rapid time to production and value? The answers are found in the fully updated new edition of Manufacturing Engineering Handbook. The goal of this second edition is to provide the essential knowledge needed to build products with the highest quality at the lowest cost in the least amount of time by optimizing all aspects of the manufacturing process—design, development, tools, processes, quality, speed, output, safety, and sustainability. You will gain access to information on conventional and modern technologies, manufacturing processes, and operations management that will assist you in achieving these goals. The book is written by a team of more than 100 internationally renowned manufacturing engineering experts, and pared down from its original 1200 pages. The new and vastly improved second edition is specifically designed to concisely and succinctly cover traditional manufacturing processes and advanced technologies as well as newer manufacturing software and systems to integrate them into the modern, global manufacturing world. Brand-new chapters on: eco-design and sustainability; nano materials and nano manufacturing; facilities planning; operations research New sections on plastics, composites, and moldmaking; global manufacturing and supply chain management Increased coverage of Design for Six Sigma and adaptive manufacturing Affiliated web site with color illustrations, graphs, charts, discussions on future trends, additional technical papers, and suggestions for further reading
Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling
Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities. •Nanotechnology and microsystems manufacturing •FinFET and nanoscale silicide formation •Physical design for high-performance, low-power 3D circuits •Epitaxi, anneals, RTP, and oxidation •Microlithography, etching, and ion implantations •Physical, chemical, electrochemical, and atomic layer vapor deposition •Chemical mechanical planarization •Atomic force metrology •Packaging, bonding, and interconnects •Flexible hybrid electronics •Flat-panel,flexible display electronics, and photovoltaics •Gas distribution systems •Ultrapure water and filtration •Process chemicals handling and abatement •Chemical and slurry handling systems •Yield management, CIM, and factory automation •Manufacturing execution systems •Advanced process control •Airborne molecular contamination •ESD controls in clean-room environments •Vacuum systems and RF plasma systems •IC manufacturing parts cleaning technology •Vibration and noise design •And much more
Recent research has led to a deeper understanding of the nature and consequences of interactions between materials on an atomic scale. The results have resonated throughout the field of tribology. For example, new applications require detailed understanding of the tribological process on macro- and microscales and new knowledge guides the rational
The updated Revision of the Bestseller--In a more Useful Format! Mechanical Engineers' Handbook has a long tradition as a single resource of valuable information related to specialty areas in the diverse industries and job functions in which mechanical engineers work. This Third Edition, the most aggressive revision to date, goes beyond the straight data, formulas, and calculations provided in other handbooks and focuses on authoritative discussions, real-world examples, and insightful analyses while covering more topics that in previous editions. Book 2: Instrumentation, Systems, Controls, and MEMS is comprised of two major parts, conveniently put together because feedback control systems require measurement transducers. The first part covers instrumentation, including transducer design, strain gages, flow meters, digital integrated circuits, and issues involved in processing transducer signals and acquiring and displaying data. The second part addresses systems and control, including: * Control system design, analysis, and performance modification * Design of servoactuators, controllers, and general-purpose control devices * "New departures" in mechanical engineering, including neural networks, mechatronics, and MEMS
This handbook is a world-class reference volume on the processes, industry requirements, and emerging application areas of printed electronics. Containing contributions from experts in academia and industry, it provides a balanced presentation of the field and is appropriate for a wide audience, from students, to researchers and industrial product designers. It is organized into 3 sections; the first focuses on materials used in printed electronics devices. Chapters cover the requirements for components such as active materials, interconnects, passives, substrates and encapsulation, current state-of-the-art, and possible future developments. Fundamental performance requirements are also critically assessed and compared with properties of materials currently available.The second section covers all aspects of available and foreseeable process technology and critically reviews the suitability of methods and materials for production processes. Topics that are addressed include fabrication, dispersion and inks, film formation and drying processes, sheet-based and roll-to-roll printing techniques, encapsulation processes, microcontact printing, and nano-imprint lithography.The last section presents an overview of device-level printed electronics and technologies that have reached a level of maturation that allows for design and fabrication of integrated modules and systems. The current research and industrial developments are reviewed for printed lighting and displays, printed photovoltaics, organic/inorganic/hybrid components for printed electronics, printed transistors and logic structures, and printed energy storage devices.
Aerogels are the lightest solids known. Up to 1000 times lighter than glass and with a density as low as only four times that of air, they show very high thermal, electrical and acoustic insulation values and hold many entries in Guinness World Records. Originally based on silica, R&D efforts have extended this class of materials to non-silicate inorganic oxides, natural and synthetic organic polymers, carbon, metal and ceramic materials, etc. Composite systems involving polymer-crosslinked aerogels and interpenetrating hybrid networks have been developed and exhibit remarkable mechanical strength and flexibility. Even more exotic aerogels based on clays, chalcogenides, phosphides, quantum dots, and biopolymers such as chitosan are opening new applications for the construction, transportation, energy, defense and healthcare industries. Applications in electronics, chemistry, mechanics, engineering, energy production and storage, sensors, medicine, nanotechnology, military and aerospace, oil and gas recovery, thermal insulation and household uses are being developed with an estimated annual market growth rate of around 70% until 2015. The Aerogels Handbook summarizes state-of-the-art developments and processing of inorganic, organic, and composite aerogels, including the most important methods of synthesis, characterization as well as their typical applications and their possible market impact. Readers will find an exhaustive overview of all aerogel materials known today, their fabrication, upscaling aspects, physical and chemical properties, and most recent advances towards applications and commercial products, some of which are commercially available today. Key Features: •Edited and written by recognized worldwide leaders in the field •Appeals to a broad audience of materials scientists, chemists, and engineers in academic research and industrial R&D •Covers inorganic, organic, and composite aerogels •Describes military, aerospace, building industry, household, environmental, energy, and biomedical applications among others