Technology & Engineering

Process Variations in Microsystems Manufacturing

Author: Michael Huff

Publisher: Springer Nature

ISBN:

Category: Technology & Engineering

Page: 521

View: 717

This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.
Electronic books

Cost-Driven Design of Smart Microsystems

Author: Michael Niedermayer

Publisher: Artech House

ISBN:

Category: Electronic books

Page: 243

View: 703

TodayOCOs professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Written by leading experts, the book offers detailed coverage of the key topics that you need to understand for your work in the field, such as methods for cost estimation, holistic design optimization, a methodology for a cost-driven design, and applied cost optimization. This practical book focuses on fundamental cost influences rather than absolute numbers, helping you appreciate relative values which reflect the competitive advantage of the various design implementations. Moreover, you find specific recommendations on which cost-reduction methods will be most advantageous in varying situations. This forward-looking volume provides keen insight into the underlying factors which drive the current economics and determine future trends of smart microsystems.
Technology & Engineering

Comprehensive Materials Processing

Author:

Publisher: Newnes

ISBN:

Category: Technology & Engineering

Page: 5634

View: 846

Comprehensive Materials Processing provides students and professionals with a one-stop resource consolidating and enhancing the literature of the materials processing and manufacturing universe. It provides authoritative analysis of all processes, technologies, and techniques for converting industrial materials from a raw state into finished parts or products. Assisting scientists and engineers in the selection, design, and use of materials, whether in the lab or in industry, it matches the adaptive complexity of emergent materials and processing technologies. Extensive traditional article-level academic discussion of core theories and applications is supplemented by applied case studies and advanced multimedia features. Coverage encompasses the general categories of solidification, powder, deposition, and deformation processing, and includes discussion on plant and tool design, analysis and characterization of processing techniques, high-temperatures studies, and the influence of process scale on component characteristics and behavior. Authored and reviewed by world-class academic and industrial specialists in each subject field Practical tools such as integrated case studies, user-defined process schemata, and multimedia modeling and functionality Maximizes research efficiency by collating the most important and established information in one place with integrated applets linking to relevant outside sources
Technology & Engineering

Design and Manufacturing of Active Microsystems

Author: Stephanus Büttgenbach

Publisher: Springer Science & Business Media

ISBN:

Category: Technology & Engineering

Page: 444

View: 950

This book presents the design and manufacturing of microsystems as well as necessary key technologies developed within the Collaborative Research Center 516. The research efforts of this collaboration are focused on active micro systems which are based on the electromagnetic actuator principle. The travel of the investigated actuator systems is on the order of several millimeters. The total construction size of the actuator is on the range of several centimeters whereas essential structures being several micrometers. The methods and the production technologies that are investigated on the basis of various research models incorporate the fundamental process chains of microsystems.
Technology & Engineering

Advanced Microsystems for Automotive Applications 2001

Author: Sven Krüger

Publisher: Springer Science & Business Media

ISBN:

Category: Technology & Engineering

Page: 306

View: 776

Microsystems are an important success factor in the automobile industry. In order to fulfil the customers'requests for safety convenience and vehicle economy, and to satisfy environmental requirements, microsystems are becoming indispensable. Thus a large number of microsystem applications came into the discussion. With the international conference AMAA 2001, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacrurers.
Technology & Engineering

Microsystems Dynamics

Author: Vytautas Ostasevicius

Publisher: Springer Science & Business Media

ISBN:

Category: Technology & Engineering

Page: 214

View: 449

In recent years microelectromechanical systems (MEMS) have emerged as a new technology with enormous application potential. MEMS manufacturing techniques are essentially the same as those used in the semiconductor industry, therefore they can be produced in large quantities at low cost. The added benefits of lightweight, miniature size and low energy consumption make MEMS commercialization very attractive. Modeling and simulation is an indispensable tool in the process of studying these new dynamic phenomena, development of new microdevices and improvement of the existing designs. MEMS technology is inherently multidisciplinary since operation of microdevices involves interaction of several energy domains of different physical nature, for example, mechanical, fluidic and electric forces. Dynamic behavior of contact-type electrostatic microactuators, such as a microswitches, is determined by nonlinear fluidic-structural, electrostatic-structural and vibro-impact interactions. The latter is particularly important: Therefore it is crucial to develop accurate computational models for numerical analysis of the aforementioned interactions in order to better understand coupled-field effects, study important system dynamic characteristics and thereby formulate guidelines for the development of more reliable microdevices with enhanced performance, reliability and functionality.
Technology & Engineering

Fundamentals of Microsystems Packaging

Author: Tummala

Publisher: McGraw Hill Professional

ISBN:

Category: Technology & Engineering

Page: 967

View: 923

"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing"
Technology & Engineering

Optomechatronic Micro/nano Components, Devices, and Systems

Author: Yoshitada Katagiri

Publisher: Society of Photo Optical

ISBN:

Category: Technology & Engineering

Page: 292

View: 720

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Science

Sensors, Actuators, and Microsystems (General) - 215th ECS Meeting

Author: G. Hunter

Publisher: The Electrochemical Society

ISBN:

Category: Science

Page: 65

View: 484

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Sensors, Actuators, and Microsystems General Session¿, held during the 215th meeting of The Electrochemical Society, in San Francisco, CA from May 24 to 29, 2009.
Technology & Engineering

Semiconductor Manufacturing Handbook, Second Edition

Author: Hwaiyu Geng

Publisher: McGraw Hill Professional

ISBN:

Category: Technology & Engineering

Page: 704

View: 411

Thoroughly Revised, State-of-the-Art Semiconductor Design, Manufacturing, and Operations Information Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. Semiconductor Manufacturing Handbook, Second Edition, covers the emerging technologies that enable the Internet of Things, the Industrial Internet of Things, data analytics, artificial intelligence, augmented reality, and and smart manufacturing. You will get complete details on semiconductor fundamentals, front- and back-end processes, nanotechnology, photovoltaics, gases and chemicals, fab yield, and operations and facilities. •Nanotechnology and microsystems manufacturing •FinFET and nanoscale silicide formation •Physical design for high-performance, low-power 3D circuits •Epitaxi, anneals, RTP, and oxidation •Microlithography, etching, and ion implantations •Physical, chemical, electrochemical, and atomic layer vapor deposition •Chemical mechanical planarization •Atomic force metrology •Packaging, bonding, and interconnects •Flexible hybrid electronics •Flat-panel,flexible display electronics, and photovoltaics •Gas distribution systems •Ultrapure water and filtration •Process chemicals handling and abatement •Chemical and slurry handling systems •Yield management, CIM, and factory automation •Manufacturing execution systems •Advanced process control •Airborne molecular contamination •ESD controls in clean-room environments •Vacuum systems and RF plasma systems •IC manufacturing parts cleaning technology •Vibration and noise design •And much more
Political Science

Intelligent Integrated Microsystems

Author: Ravindra A. Athale

Publisher: Society of Photo Optical

ISBN:

Category: Political Science

Page: 194

View: 573

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Technology & Engineering

International Symposium on Quality Electronic Design

Author:

Publisher: IEEE

ISBN:

Category: Technology & Engineering

Page: 549

View: 773

Annotation Fifty-one papers and 21 posters from the March 2002 symposium report current research in deep submicron integrated circuit design and development. The sessions address interconnect extraction and modeling, design for process variations, metrics, power and noise management, verification, signal integrity, and low power design techniques. Some of the topics are transition aware global signaling (TAGS), the interoperability of EDA tools for sequential logic synthesis, statistical methods for the determination of process corners, power supply noise suppression via clock skew scheduling, and the relation between SAT and BDDs for equivalence checking. No subject index. Annotation copyrighted by Book News Inc., Portland, OR.